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| BUZ 101 SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated * dv/dt rated * Low on-resistance * 175C operating temperature * also in TO-220 SMD available Pin 1 G Type BUZ 101 Pin 2 D Pin 3 S VDS 50 V ID 29 A RDS(on) 0.06 Package TO-220 AB Ordering Code C67078-S1350-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 29 Unit A ID IDpuls 116 TC = 31 C Pulsed drain current TC = 25 C Avalanche energy, single pulse EAS 70 dv/dt 6 mJ ID = 29 A, VDD = 25 V, RGS = 25 L = 83 H, Tj = 25 C Reverse diode dv/dt kV/s IS = 29 A, VDS = 40 V, diF/dt = 200 A/s Tjmax = 175 C Gate source voltage Power dissipation VGS Ptot 20 100 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Tj Tstg RthJC RthJA -55 ... + 175 -55 ... + 175 1.5 75 E 55 / 175 / 56 C K/W Semiconductor Group 1 07/96 BUZ 101 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 50 3 0.1 1 10 10 0.036 4 1 100 100 100 V VGS = 0 V, ID = 0.25 mA, Tj = -40 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS A nA A nA 0.06 VDS = 50 V, VGS = 0 V, Tj = 25 C VDS = 50 V, VGS = 0 V, Tj = -40 C VDS = 50 V, VGS = 0 V, Tj = 150 C Gate-source leakage current IGSS RDS(on) VGS = 20 V, VDS = 0 V Drain-Source on-resistance VGS = 10 V, ID = 21 A Semiconductor Group 2 07/96 BUZ 101 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 7 13.5 680 240 90 - S pF 900 360 135 ns 15 23 VDS 2 * ID * RDS(on)max, ID = 21 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Rise time tr 55 85 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Turn-off delay time td(off) 100 135 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Fall time tf 70 95 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Semiconductor Group 3 07/96 BUZ 101 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 1.2 60 0.12 29 116 V 2 ns C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 58 A Reverse recovery time VR = 30 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 30 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 101 Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 30 A 110 W 26 Ptot 90 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 C 180 ID 24 22 20 18 16 14 12 10 8 6 4 2 0 0 20 40 60 80 100 120 140 C 180 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 3 Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 1 K/W A ID t = 11.0s p ZthJC 10 2 10 0 /ID = ) on S( RD 1 ms V D S 100 s 10 -1 D = 0.50 0.20 0.10 10 -2 10 ms 10 1 0.05 0.02 single pulse 0.01 DC 10 0 10 0 10 1 V 10 2 10 -3 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 101 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 65 A 55 Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 0.19 Ptot = 100W l k j VGS [V] i a b 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 a b c d e f g h ID 50 45 40 35 30 25 20 d e f g 0.16 RDS (on) 0.14 0.12 0.10 0.08 0.06 i hc d e f g h i j k 10.0 l 20.0 15 10 5 0 0.0 a c b 0.04 k j 0.02 0.00 0 VGS [V] = a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 h i j k 8.0 9.0 10.0 20.0 1.0 2.0 3.0 4.0 V 5.5 10 20 30 40 A 60 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 60 A 50 parameter: tp = 80 s, VDS2 x ID x RDS(on)max 15 S 13 ID 45 40 35 30 25 20 15 10 gfs 12 11 10 9 8 7 6 5 4 3 2 5 0 0 1 2 3 4 5 6 7 8 V 10 VGS 1 0 0 10 20 30 40 A 60 ID Semiconductor Group 6 07/96 BUZ 101 Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 21 A, VGS = 10 V 0.17 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 0.14 RDS (on) 0.12 0.10 98% VGS(th) 3.6 3.2 2.8 2.4 typ 0.08 0.06 98% 2.0 1.6 2% typ 1.2 0.04 0.8 0.02 0.00 -60 0.4 0.0 -60 -20 20 60 100 C 180 -20 20 60 100 C 180 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 4 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 3 pF A C 10 3 IF 10 2 Ciss Coss 10 2 10 1 Crss Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 1 0 5 10 15 20 25 30 V 40 VDS 10 0 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 101 Avalanche energy EAS = (Tj ) parameter: ID = 29 A, VDD = 25 V RGS = 25 , L = 83 H 75 mJ 65 Typ. gate charge VGS = (QGate) parameter: ID puls = 44 A 16 V EAS 60 55 50 45 40 35 30 25 20 15 10 5 0 20 VGS 12 0,2 VDS max 0,8 VDS max 10 8 6 4 2 0 40 60 80 100 120 140 C 180 0 5 10 15 20 25 30 35 nC 45 Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 62 V 60 V(BR)DSS 59 58 57 56 55 54 53 52 51 50 49 48 47 -60 -20 20 60 100 C 180 Tj Semiconductor Group 8 07/96 BUZ 101 Package Outlines TO-220 AB Dimension in mm Semiconductor Group 9 07/96 |
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